Referenced Items are not available for this document.
Christophe joined Yole Développement after several positions in the wafer fab and packaging environments of CEA-Leti, STMicroelectronics and then TriQuint Semiconductor, where he has developed Wafer Level packaging technology and flipchip technology for SAW duplexers. He is now project manager at Yole for Advance Packaging, WLP & 3D system Integration and RF devices.
Published in:
3D Systems Integration Conference (3DIC), 2010 IEEE International
Date of Conference: 16-18 Nov. 2010
- Page(s):
- 1 - 2
- Print ISBN:
- 978-1-4577-0526-7
- Conference Location :
- Munich, Germany
- Digital Object Identifier :
- 10.1109/3DIC.2010.5751427
- Product Type:
- Conference Publications
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