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3D R&D technology for the future voyage in Japan

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1 Author(s)
Kenzo Inagaki ; Assoc. of Super-Adv. Electron. Technol. (ASET), Kokubunji, Japan

Present a collection of slides covering the following topics: 3D R&D technology for the future voyage in Japan; Moore's law limitation and possible technology solutiuons; 3DIC (dream chip) application fields: healthcare and biology, futuristic robots, advanced consumer electronics, and laptop supercomputers; communication; ubiquitous computing, autopilot for cars; capsule for inspection by CCD or CMOS camera; capsule for inspection, medication & micro operation; retinal prosthesis with 3D staked retinal prosthesis chip; structure of the human retina and 3D stacked retinal prosthesis chip; photograph of fabricated retinal prosthesis module; waveform of recorded electrical evoked potential by using Pt-b stimulus electrode; 3DIC application: automotive, sensor network, ubiquitous platform, ubiquitous platform using μ-chip, for a sustainable society; ASET dream chip project; high frame-rate image sensor; high-bandwidth memory; 3D reconfigurable device (flex chip); RF MEMS device; enabling technology: process technology, design environment, interposer technology, contact/contactless wafer probing & burn-in, and cooling and stacking/bonding; oral and poster list of ASET members; industrial structure- future; and mandatory to establish a new business scheme.

Published in:

3D Systems Integration Conference (3DIC), 2010 IEEE International

Date of Conference:

16-18 Nov. 2010