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3D integration infrastructure & market status

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1 Author(s)
Zinck, C.

A collection of slides for the author's conference is presented. Topic discussed is about 3D integration infrastructure and its market status.

Published in:
3D Systems Integration Conference (3DIC), 2010 IEEE International

Date of Conference: 16-18 Nov. 2010

Page(s):
1 - 34
Print ISBN:
978-1-4577-0526-7
INSPEC Accession Number:
11945599
Conference Location :
Munich
Digital Object Identifier :
10.1109/3DIC.2010.5751425
Product Type:
Conference Publications

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