Referenced Items are not available for this document.
Presents a collection of slides covering the following topics: 3D heterogenous integration; Moore's law; RF MEMS; antenna; TSV; carbon nanotubes; and silicon nanowires.
Published in:
3D Systems Integration Conference (3DIC), 2010 IEEE International
Date of Conference: 16-18 Nov. 2010
- Page(s):
- 1 - 19
- Print ISBN:
- 978-1-4577-0526-7
- INSPEC Accession Number:
- 11945597
- Conference Location :
- Munich
- Digital Object Identifier :
- 10.1109/3DIC.2010.5751423
- Product Type:
- Conference Publications
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