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A broadband THz imager in a low-cost CMOS technology

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9 Author(s)
Schuster, F. ; CEA-LETI-MINATEC, Grenoble, France ; Videlier, H. ; Dupret, A. ; Coquillat, D.
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The paper demonstrates a complete acquisition chain of a 300GHz to 1THz image sensor with on-chip multiplexing in a 0.13μm bulk silicon CMOS technology. The pixel consumes less than 100μW and has a responsivity of 90kV/W at 300GHz and of 1.8kV/W at 1.05THz respectively. High resolution and contrast THz images revealing the inner structure of tree leaves are presented. These results show that multi-frequency and room temperature imaging systems are possible in cost-effective CMOS technologies.

Published in:

Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International

Date of Conference:

20-24 Feb. 2011

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