Referenced Items are not available for this document.
The model of heat exchange process in the flat plate, which surface during the fist stage dissipates heat only due to convection, but when temperature becomes critical, the liquid is supplied on the surface of the plate, and evaporating cools the plate, has been built. The solution of the model problem has been found by the numerical method. The analysis of transient changes of the temperature fields have been made.
Published in:
CAD Systems in Microelectronics (CADSM), 2011 11th International Conference The Experience of Designing and Application of
Date of Conference: 23-25 Feb. 2011
- Page(s):
- 12 - 14
- Print ISBN:
- 978-1-4577-0042-2
- INSPEC Accession Number:
- 11930431
- Conference Location :
- Polyana-Svalyava
- Product Type:
- Conference Publications
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