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Intrinsic Reliability Improvement in Biaxially Strained SiGe p-MOSFETs

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8 Author(s)
Deora, S. ; Dept. of Electr. Eng., Indian Inst. of Technol. Bombay, Mumbai, India ; Paul, A. ; Bijesh, R. ; Huang, J.
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In this letter, we show an improvement not only in performance but also in reliability of a 30-nm-thick biaxially strained SiGe (20% Ge) channel on Si p-type metal-oxide semiconductor field-effect transistors. Compared with a Si chan nel, a strained SiGe channel allows larger hole mobility μh in the transport direction and alleviates charge flow toward the gate oxide. μh enhancement by 40% in SiGe and 100% in Si-cap/SiGe is observed compared with Si hole universal mobility. A ~40% reduction in negative-bias temperature instability degradation, gate leakage, and flicker noise is observed, which is attributed to a 4% increase in the hole-oxide barrier height φ in SiGe. A similar field acceleration factor Γ for the threshold voltage shift ΔVG and an increase in noise ΔSVG m Si and SiGe suggest identical degradation mechanisms.

Published in:

Electron Device Letters, IEEE  (Volume:32 ,  Issue: 3 )