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A system simulation technique combining SPICE and SIMULINK tools

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2 Author(s)
Wilson, C.G. ; Electr. & Comput. Eng. Dept., Auburn Univ., Auburn, AL, USA ; Hung, J.Y.

This paper presents a system simulation technique that combines the capabilities of two defacto standard tools. The SPICE tool that accounts for electronic device characteristics is seamlessly incorporated with SIMULINK, which is a more general purpose dynamic system simulation environment. The result is a simulation technique that has the general flexibility of SIMULINK while accounting for electronic device level characteristics. The proposed technique also gives greater flexibility to the SPICE tool by simplifying the description of nonlinear circuit effects. The technique is demonstrated on a magnetic levitation system. The simultation results are in closer agreement to experimental data than the original SIMULINK model used on the project.

Published in:

IECON 2010 - 36th Annual Conference on IEEE Industrial Electronics Society

Date of Conference:

7-10 Nov. 2010

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