By Topic

Multi-Wafer Virtual Probe: Minimum-cost variation characterization by exploring wafer-to-wafer correlation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Wangyang Zhang ; Carnegie Mellon Univ., Pittsburgh, PA, USA ; Xin Li ; Acar, E. ; Liu, F.
more authors

In this paper, we propose a new technique, referred to as Multi-Wafer Virtual Probe (MVP) to efficiently model wafer-level spatial variations for nanoscale integrated circuits. Towards this goal, a novel Bayesian inference is derived to extract a shared model template to explore the wafer-to-wafer correlation information within the same lot. In addition, a robust regression algorithm is proposed to automatically detect and remove outliers (i.e., abnormal measurement data with large error) so that they do not bias the modeling results. The proposed MVP method is extensively tested for silicon measurement data collected from 200 wafers at an advanced technology node. Our experimental results demonstrate that MVP offers superior accuracy over other traditional approaches such as VP and EM, if a limited number of measurement data are available.

Published in:

Computer-Aided Design (ICCAD), 2010 IEEE/ACM International Conference on

Date of Conference:

7-11 Nov. 2010