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The thermal treatment of polyamidic acid films based on benzophenontetracarboxylic dianhydride and 4,4'-diamino-3,3'-dimethyl diphenylmethane, at different temperatures, led to polyimide structures having different degree of imidization. The thermal and dielectric characteristics of the films were investigated by using dynamic mechanical analysis, contact angles and dielectric spectroscopy measurements.
Semiconductor Conference (CAS), 2010 International (Volume:02 )
Date of Conference: 11-13 Oct. 2010