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With respect to a planar approach, 3D stacking of functional layers allows to increase the level of integration and miniaturization of communications systems. For this paper, a full 3D stacking demonstration vehicle has been realized and characterized. The feasibility of a 3D micro-wave module package has been proven by the successful realization of a 30 GHz 3D module including substrate vias, low loss interconnects, substrate shielding and MMIC integration. The impact of wire bond and CAP integration on 3D packaging performance were also investigated.
Date of Conference: 13-16 Sept. 2010