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Embedding passive components (EPCs) is known as a promising technology to provide high electrical performance and to reduce fabrication cost. This paper describes a novel approach to embed off-chip RF passives based on thin film stack. Multilayer structures are built-up on temporary glass carrier substrates by repetitive application of spin-coated polyimide layers and sputtered metal layers. After processing and testing the structures can easily be released from the carrier and embedded inside PCB or FCB (flexible PCB).
Date of Conference: 13-16 Sept. 2010