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High-power test device for package thermal assessment and validation of thermal measurement techniques

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5 Author(s)
Jorda, X. ; IMB, Centre Nac. de Microelectron., Bellaterra, Spain ; Perpina, X. ; Vellvehi, M. ; Madrid, F.
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This paper describes the structure and thermal behavior of a high-power thermal test chip (up to 200 W/cm2) designed for power electronics package assessment, which has also been used for the validation of thermal measurement techniques. In particular, we show two application examples where the proposed device allowed the assessment of different power substrate technologies, and the validation of temperature measurement techniques used to characterize the high frequency behavior of circuits and devices in the frequency domain using the heterodyne technique.

Published in:

Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on

Date of Conference:

6-8 Oct. 2010