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Passive components integration in CMOS technology

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10 Author(s)
Salimy, S. ; Inst. de Rech. en Electrotech. et Electron. de Nantes Atlantique (IREENA), Nantes Univ., Nantes, France ; Toutain, S. ; Averty, D. ; Challali, F.
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The present paper aims at integrating thin films as passive components in the Back End of Line of an industrial Si-based CMOS technology while keeping limited additional technological steps. TiNxOy and TixTayO thin films deposited by magnetron sputtering were respectively investigated as resistive and high-k materials dedicated to highly integrated resistors and capacitors. We report here on electrical characterizations of thin films of both materials regarding the performances criteria of the component versus thin film characteristics.

Published in:

Solid-State Device Research Conference (ESSDERC), 2010 Proceedings of the European

Date of Conference:

14-16 Sept. 2010