By Topic

New developed of thin plastic package with high terminal counts

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Kohara, M. ; Mitsubishi Electr. Corp., Hyogo, Japan ; Nakao, S. ; Yasunaga, M. ; Nemoto, Y.
more authors

A small and thin quad flat package (QFP)-type plastic package for large-scale integrated (LSI) logic devices with high pin counts has been developed. The size of the package with 252 input and output pins is 17.3 mm by 17.3 mm, and the thickness is 1.52 mm. The pitch and the width of the leads are 0.25 and 0.1 mm, respectively. The main technologies for assembly of the package are tape automated bonding (TAB) interconnection technology, which has been developed for bonding of high-terminal-count LSIs, and the molding technology, which has also been developed for very small and thin plastic packages. The reliability of the package and the outer lead bonding of the package were evaluated, and it was confirmed that both the package and the bonding have no problem in the pressure cooker test (PCT), the temperature cycle test, and the high-temperature-storage test

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 2 )