Referenced Items are not available for this document.
As integrated circuit geometries become smaller and package sizes and I/O counts increase, there is an increased potential of failures resulting from moisture ingress and corrosion. To aid in reliability prediction, design for reliability, and assessing reliability tradeoffs, a methodology for coupling the mechanisms of moisture ingress and corrosion in microelectronic packages into a first-order failure-rate model is presented. The model focuses on aluminum metallization corrosion resulting from chlorine-based contaminants, but is general enough to be applied to other cases
Published in:
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
(Volume:13
,
Issue:
2
)
Date of Publication: Jun 1990
- Page(s):
- 383 - 389
- ISSN :
- 0148-6411
- INSPEC Accession Number:
- 3735388
- Digital Object Identifier :
- 10.1109/33.56172
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Jun 1990
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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