Cart (Loading....) | Create Account
Close category search window

Automatic defect classification of printed wiring board solder joints

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Driels, M.R. ; Dept. of Mech. Eng., US Naval Postgraduate Sch., Monterey, CA, USA ; Nolan, D.J.

An automatic windowing algorithm is developed for use in automatic printed wiring board solder joint inspection. The method uses Hough curve detection to locate the solder joint within the image. Eleven good features selected by C.-C. Lee (1987) for use in the solder joint inspection task are studied in detail for purposes of optimizing the inspection process. This is done with the aid of a minimum distance classification algorithm that allows for classification of the solder joint based on user selected features. Automatic windowing, feature selection, and classification algorithms are compiled into a complete solder joint inspection system

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 2 )

Date of Publication:

Jun 1990

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.