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Nanomaterials for Electronic Packaging: Toward Extreme Miniaturization [Nanopackaging]

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2 Author(s)
Rabindra N. Das ; An R&D engineer/scientist at Endicott Interconnect Technologies. ; Voya R. Markovich

This article examines the use of nanomaterials in the area of electronic packaging. This includes capacitors and resistors as embedded passives, low-k materials, electrically conducting adhesives (ECAs) as interconnects, thermal interface materials (TIMs), etc.

Published in:

IEEE Nanotechnology Magazine  (Volume:4 ,  Issue: 4 )