Cart (Loading....) | Create Account
Close category search window

The anti-pyramid distribution in SIP using LTCC technology

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Yingli Liu ; State Key Lab. of Electron. Thin Film & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China ; Yuanxun Li ; Yunsong Xie ; Huaiwu Zhang
more authors

The anti-pyramid stacked chips distribution that can be applied in SIP is reported to have a much better thermal performance comparing to the widely used pyramid distribution. When the package of system is using PCB and LTCC condition, the highest temperature is brought down from 440°K to 417°K and from 326°K to 319°K respectively. In addition, it is also analyzed that the anti-pyramid distribution makes the LTCC packaged system not only has better thermal performance, but also be more reliable. So it is strongly suggested that when the SIP encounter some serious thermal problem, both anti-pyramid stacked chips and LTCC technology should be applied to overcome this problem.

Published in:

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Date of Conference:

16-19 Aug. 2010

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.