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The next generation advanced MEMS& sensor packaging

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4 Author(s)
Lingen Wang ; Boschman Technologies B.V., Stenograaf 3, 6921 EX DUIVEN, the Netherlands ; Arnold Bos ; Ton van Weelden ; Frank Boschman

The needs of ambient intelligence and miniaturization of electronics require extensive integration of semiconductor components such as MEMS and sensor. A MEMS/sensor package needs access to environment via open windows, which is a challenge for MEMS or sensor packaging/encapsulation. An exposed window is needed to access to the environment for encapsulated MEMS package like gas and liquid sensors. Generally, the exposed die and MEMS/sensor are brittle and can not stand large stress. By clamping the film around the chip's functional area, the surface of the chip is protected from the compound and will be bleed and flash free. Comparing to steel clamping, the clamping force can decrease dramatically with soft film conpensation. Boschman Film Assisted Molding (FAM) technology can meet the packaging demand of the MEMS and sensor functional opening area. FAM technology can fulfill the requirement of encapsulation of the next generation advanced MEMS microsystem with low cost and excellent performance. Boschman Film Assisted Molding (FAM) technology also offers perfect encapsulating solution for Flat No leads packages such as QFN with high quality and low cost. With Boschman FAM technology, QFN can be encapsulated without the expensive tape and additional process of pre-tape and de-tape. This paper will introduce an advanced MEMS/sensor FAM encapsulation/packaging with excellent performance and low cost. A combination of FAM and wafer level molding enable MEMS/sensor wafer level encapsulation/packaging with low cost, good quality and high reliability. The encapsulation of QFN MEMS/sensor is available with Boschman Film Assisted Molding double films technology.

Published in:

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Date of Conference:

16-19 Aug. 2010