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Investigation of an on product high-k/metal metrology methodology using an in-line, high throughput XPS measurement technique

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9 Author(s)
Min Dai ; IBM, Hopewell Junction, NY, USA ; Klare, M. ; Rangarajan, S. ; Chudzik, M.P.
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In this paper, we investigated a novel and unique, high throughput, inline XPS technique for thin film (<; 100 A) measurements, such as SiON and HfO2. Inline XPS measurement capability was evaluated using four separate techniques; offline SIMS, offline XPS, inline ellipsometry and inline micro X-ray fluorescence (XRF). A Nitrogen sensitivity test determined that the detection limit was on the order of 5×13 atm/cm2 in a thin SiON layer. The success of decoupling the thickness of the bi-layer HfO2/SiON/Si film was demonstrated. Long term dynamic precision and short term repeatability for high-k film measurements are also discussed for both thickness and composition. These values were determined to be less than 1% of the nominal value (1sigma).

Published in:
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI

Date of Conference: 11-13 July 2010

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