Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. For technical support, please contact us at onlinesupport@ieee.org. We apologize for any inconvenience.
By Topic

32nm yield learning using efficient parallel-test structures

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Karthikeyan, M. ; IBM Syst. & Technol. Group, Hopewell Junction, NY, USA ; Medina, L. ; Shiling, E. ; Kiesling, D.

The continuing rise in the number and complexity of test structures required to characterize every new technology generation demands at least a commensurate increase in test throughput. At IBM, various 32nm yield test structures are being tested on a functional test platform using customized Source Measurement Units (SMU) that allow parallel current measurement on up to 100 pins. This novel method improves test throughput as much as 9X over traditional parametric testing while offering current measurement resolution down to 100 fA. The test structures described herein help accelerate yield learning by enabling characterization of yield-loss mechanisms and rapid evaluation of yield improvement actions.

Published in:

Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI

Date of Conference:

11-13 July 2010