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An increased demand for high performance Thermal Interface Materials (TIMs) has been stimulated by a trend of higher power electronic designs producing significant amounts of heat. Defining the best TIM for an application requires consideration of several factors including thermal and mechanical performance, ease of assembly, reliability, and cost. The focus of this paper includes discussions of a high-throughput method for characterization of the thermal performance of materials and the properties of several thermal interface materials including grease, adhesives and Phase Change Materials (PCM).
Published in:
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Date of Conference: 2-5 June 2010
- Page(s):
- 1 - 6
- ISSN :
- 1087-9870
- E-ISBN :
- 978-1-4244-5343-6
- Print ISBN:
- 978-1-4244-5342-9
- INSPEC Accession Number:
- 11482617
- Conference Location :
- Las Vegas, NV
- Digital Object Identifier :
- 10.1109/ITHERM.2010.5501344
- Product Type:
- Conference Publications
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