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A wafer-bonded floating-element shear stress microsensor with optical position sensing by photodiodes

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4 Author(s)
A. Padmanabhan ; Microsystems Technol. Lab., MIT, Cambridge, MA, USA ; H. Goldberg ; K. D. Breuer ; M. A. Schmidt

This paper discusses a noninvasive sensing technique for the direct measurement of low-magnitude shear stresses in laminar and turbulent air flows. The sensing scheme detects the flow-induced in-plane displacement of a microfabricated floating-element structure (500 μm×500 μm×7 μm), using integrated photodiodes. The wall-mounted floating-element sensors were fabricated using a wafer-bonding technology. The sensors were calibrated in a custom-designed laminar flow cell and subsequently shown to be able to transduce shear stresses of 0.01 Pa during tests in a low-speed wind tunnel

Published in:

Journal of Microelectromechanical Systems  (Volume:5 ,  Issue: 4 )