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Application of path integrals in modeling transmission line loss

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1 Author(s)
Rubin, L.M. ; Viewlogic Quad Design Group, Camarillo, CA, USA

In signal integrity applications involving the modeling and analysis of high-speed digital interconnects, it is necessary to include the effects of nonideal transmission line behavior due to, for example, the effects of ohmic, dielectric, and skin effect losses. This paper describes a new approach to this problem by employing a path integral formulation to both model lossy and nonuniform transmission line behavior. The algorithm resulting from the application of this formulation is accurate, stable, computationally efficient, and applicable to time domain modeling of interconnect in digital systems

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 4 )

Date of Publication:

Nov 1996

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