Cart (Loading....) | Create Account
Close category search window
 

Defect formation mechanisms in laser welding techniques for semiconductor laser packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Wood-Hi Cheng ; Inst. of Electro-Opt. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan ; Wei-Han Wang ; Jyh-Cheng Chen

In this work, the authors experimentally investigate defect formation mechanisms in spot-welding techniques for semiconductor laser packaging. Results obtained from the stainless-to-stainless steel joints indicate that the dimension of hole formation depends on the laser power density, and the hole disappears as the power density is below 3×105 W/cm2. In the stainless-to-KovarTM joints, surface cracks are eliminated by reducing the gold thickness from the KovarTM before welding, while the centerline cracks in the fusion zone are eliminated by the air gap tightness between the KovarTM and stainless steel. The excess laser energy is the possible cause for hole formation. The low solubility of gold in the KovarTM and the large air gap between the joints are the possible causes for surface cracks and enhancing centerline crack propagation, respectively. A technique for reduction of post weld shift (PWS) in semiconductor laser packaging is also presented. Preliminary reliability data demonstrated that these laser packages, which do not have hole and crack defects in the welded joints, are reliable

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 4 )

Date of Publication:

Nov 1996

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.