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This paper presents a novel multi-step three dimensional microassembly of passive-circuit-mesh, conductive beads, and LED chips to fabricate a flexible, bright, and wide viewing angle display. A novel flexible display architecture is proposed. To deliver this design, we focus our efforts on the multi-batch assembly integration. A 3-by-3 light-emitting diode array with a chip size of 610 Â¿m by 610 Â¿m by 90 Â¿m is successfully prototyped with device fill factor up to 37.97%. It yields a 990 Â¿m squared monochromatic pixel.
Date of Conference: 24-28 Jan. 2010