Silicide yield improvement with NiPtSi formation by laser anneal for advanced low power platform CMOS technology

A novel silicide formation technique using millisecond anneal is reported for the first time, delivering superior silicide film morphology that translates electrically into significant yield improvement over a conventional soak anneal, without any degradation of transistor performances. In addition, we demonstrate how this new technique enables the integration of thin silicides required for further junction scaling, and demonstrate up to 6 nm gate length reduction and more than 1 decade junction leakage improvement.