By Topic

Improving reliability of lateral thermosonic flip-chip bonding with ACF

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Chang-Wan Ha ; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 373-1 Guseong-dong, Yuseong-gu, Daejoen, 305-701, Korea ; Kyung-Soo Kim

For interconnection of liquid crystal display (LCD) driver IC, in this paper, thermosonic (TS) flip chip bonding technique which utilizes a lateral ultrasonic vibration as an additional heat source is considered. Larger amplitude of vibration produces more heat energy, which would accelerate the curing process of epoxy. In order to avoid potential problems due to large vibration amplitude such as misalignment between bump and pad, and the plastic deformation of epoxy resin, the viscoelastic characteristics of ACF epoxy are investigated. Based on experimental results, a useful guideline to determine the vibration amplitude is newly proposed. Moreover, the experimental results clearly show the relationship between curing degree and reliable amplitude range of vibration.

Published in:

Electronics Packaging Technology Conference, 2009. EPTC '09. 11th

Date of Conference:

9-11 Dec. 2009