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Packaging for Integrated Communication Microsystems

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4 Author(s)

This chapter contains sections titled:
Introduction
Background
Elements of a Package
Current Chip Packaging Technologies
Driving Forces for RF Packaging Technology
MCM Definitions and Classifications
RF-SOP Modules
Package Modeling and Optimization
Future Packaging Trends
Chip-Package Codesign
Package Models and Transmission Lines
Calculations for Package Elements
Crosstalk
Grounding
Practical Issues in Packaging
Chip-Package Codesign Examples
Wafer Scale Package
Filters Using Bondwire
Packaging Limitation
Conclusion
References