Packaging for Integrated Communication Microsystems

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4 Author(s)

This chapter contains sections titled:

  • Introduction

  • Background

  • Elements of a Package

  • Current Chip Packaging Technologies

  • Driving Forces for RF Packaging Technology

  • MCM Definitions and Classifications

  • RF-SOP Modules

  • Package Modeling and Optimization

  • Future Packaging Trends

  • Chip-Package Codesign

  • Package Models and Transmission Lines

  • Calculations for Package Elements

  • Crosstalk

  • Grounding

  • Practical Issues in Packaging

  • Chip-Package Codesign Examples

  • Wafer Scale Package

  • Filters Using Bondwire

  • Packaging Limitation

  • Conclusion

  • References