By Topic

Packaging for Integrated Communication Microsystems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)

This chapter contains sections titled:
Elements of a Package
Current Chip Packaging Technologies
Driving Forces for RF Packaging Technology
MCM Definitions and Classifications
RF-SOP Modules
Package Modeling and Optimization
Future Packaging Trends
Chip-Package Codesign
Package Models and Transmission Lines
Calculations for Package Elements
Practical Issues in Packaging
Chip-Package Codesign Examples
Wafer Scale Package
Filters Using Bondwire
Packaging Limitation