Scheduled Maintenance on May 23rd, 2017:
IEEE Xplore will undergo an upgrade from 1:00 - 4:00 PM EDT. During this time there may be intermittent impact on performance. We apologize for any inconvenience.
By Topic

Packaging for Integrated Communication Microsystems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.
4 Author(s)

This chapter contains sections titled:
Elements of a Package
Current Chip Packaging Technologies
Driving Forces for RF Packaging Technology
MCM Definitions and Classifications
RF-SOP Modules
Package Modeling and Optimization
Future Packaging Trends
Chip-Package Codesign
Package Models and Transmission Lines
Calculations for Package Elements
Practical Issues in Packaging
Chip-Package Codesign Examples
Wafer Scale Package
Filters Using Bondwire
Packaging Limitation