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Packaging design challenges of the IBM System z10 Enterprise Class server

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11 Author(s)
Winkel, T.-M. ; IBM Systems and Technology Group, IBM Entwicklung GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany ; Harrer, H. ; Kaller, D. ; Supper, J.
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This paper describes the system packaging and technologies of the IBM System z10™ high-end Enterprise Class server. This machine exceeds the multiprocessor performance of the previous system by 50%. A new generation of the IBM Elastic Interface was developed in order to maintain the increased interconnect signal speed of up to 2.93 Gb/s. Power control and power delivery to the multicore processors were a special challenge for the server packaging because of the high currents and the high number of voltage domains.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:53 ,  Issue: 1 )

Date of Publication:

Jan. 2009

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