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1 Author(s)
Knickerbocker, John U. ; 3D and System-on-Package Technology, IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York, USA

In future systems, continuing performance improvements, power efficiency, and smaller form factors for both portable product applications and fixed location products will be important. Take, for example, the billions of portable cell phones sold each year wherein the higher function products in this family seek increasing function with each generation while maintaining a fixed size. Another example is high-performance computing systems in which higher performance levels and high power efficiency are leading to high-bandwidth and low-latency multicore processors linked to ever higher stores of close proximity memory.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:52 ,  Issue: 6 )