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This paper physically and conceptually provides a general electrothermal network pi-model. Basing on the proposed network pi-model, an equivalent electrothermal circuit model (ETCM) and the associated thermal behavior analysis are also demonstrated for the SiOB with VCSELs in terms of characteristics of device materials and geometries. The introduced complicated structure of VCSELs constructed in simulators can be greatly simplified by using the equivalent ETCM to predict the probable thermal flow paths, and eventually can achieve the goal of CPU time-saving without having complex mesh studying or scaling. In the case, comparison results between measured data, simulation and the equivalent ETCM calculation show an excellent temperature matching within plusmn2degC as well as achieving 90% CPU time-saving.