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Thermo-mechanical reliability loop in device modeling

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4 Author(s)
Bieniek, T. ; Inst. of Electron Technol., Warsaw, Poland ; Janczyk, G. ; Grabiec, P. ; Szynka, J.

3D device integration faces the designers with new thermo-mechanical design and device exploitation problems. Temperature dependent mechanical stress spreading across the device affects its performance. This paper discusses selected performance and reliability issues related device the mechanical stress and temperature influence.

Published in:
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on

Date of Conference: 7-9 Oct. 2009

Page(s):
84 - 86
Print ISBN:
978-1-4244-5881-3
INSPEC Accession Number:
10985524
Conference Location :
Leuven
Product Type:
Conference Publications

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