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Temperature as a first-class citizen in chip design

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1 Author(s)
Sapatnekar, S.S. ; Univ. of Minnesota, Minneapolis, MN, USA

With new technology trends, arising through a confluence of factors such as Moore's law scaling and 3D integration, the role of thermal design is inexorably shifting from package-centric issues towards on-chip optimizations. This talk overviews the roots of this change, the circuit effects of elevated temperatures, and on-chip optimizations for effective thermal management.

Published in:

Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on

Date of Conference:

7-9 Oct. 2009