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Browse Journals & Magazines > Components, Packaging, and Ma ...> Volume:19 Issue:3 Help

Characterization of a small peripheral array package

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5 Author(s)
Jie Hao ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Richter, A. ; Laskar, J. ; Swaminathan, M.
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This paper provides details on a very small peripheral array (VSPA) cavity package with high I/O's that is surface mountable on a printed circuit board (PCB). The package consists of 320 leads and measures 27 mm on a side. This paper discusses the package attributes, comparison to equivalent packages, and characterization of the package parasitics up to 3.5 GHz

Published in:
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 3 )

Date of Publication: Aug 1996

Page(s):
512 - 517
ISSN :
1070-9894
INSPEC Accession Number:
5359157
Digital Object Identifier :
10.1109/96.533889
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
Aug 1996
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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