Cart (Loading....) | Create Account
Close category search window
 

Using thermodynamic impact for detecting refrigerant leaks in vapor compression equipment

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Rossi, T.M. ; Dept. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA ; Braun, J.E.

A technique for detecting refrigerant leaks by utilizing their impact on the thermodynamic states of the vapor compression cycle is described. Simulation and laboratory experiments were performed to determine which of 7 inexpensive measurements contribute significantly to detection confidence. Experimental results show that suction line superheat and liquid line subcooling are the minimum measurements needed to detect and isolate refrigerant leaks from the other faults considered and provides 99.9% detection confidence with 5.5% charge loss. The addition of a hot gas line temperature sensor improves performance by allowing a 4.3% loss of charge to be detected with the same confidence. Adding more measurements did not enable smaller leaks to be detected

Published in:

American Control Conference, Proceedings of the 1995  (Volume:6 )

Date of Conference:

21-23 Jun 1995

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.