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Wafer level packaging of MEMS

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1 Author(s)
Esashi, M. ; Tohoku Univ., Sendai, Japan

Wafer level packaging methods of MEMS are described. These play important roles to reduce cost and to improve reliability. MEMS structures on silicon chips are encapsulated with bonded caps or with shells fabricated by surface micromachining, and electrical interconnections are made from the cavity. Vacuum packaging methods are also described.

Published in:

Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International

Date of Conference:

21-25 June 2009