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The goal of this paper is to present an influence of chosen production technology on quality and reliability of printed interconnections in multilayer Low Temperature Cofired Ceramics modules and to predict some of their properties. This was achieved by the mutual comparison of testing samples which were based on two different technologies. The comparison was performed after accelerated testing under severe conditions. By linking the conditions of the accelerated test with those that encountered during routine operation, it becomes possible to predict some reliability parameters and to consider the suitability of the proposed technology for batch production.