By Topic

Material characterization with the ultrasonic microscope

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Gust, N. ; Electron. Packaging Lab., Tech. Univ. of Dresden, Dresden, Germany ; Kuhnicke, E. ; Breuer, D.

An effective method for material characterization with a scanning acoustic microscope (SAM) is presented. The elastic parameters Young's modulus and bulk modulus and the density are determined from one single reflection signal. In contrast to established methods a calibration specimen is not required. Additionally, the thickness of the specimen can be estimated with two reflection signals at different focus positions. The new method evaluates the parameters of the surface echo, the longitudinal backwall echo and the mode converted transverse wave backwall echo. With estimated material characteristics, a simulation is set up and results are compared to the measured reflection parameters. Accordingly, the material characteristics are iteratively adapted until a minimum error criterion is reached. This approach can deliver results as accurate as the ultrasonic simulation. The results of a new and fast ray-trace based simulation will be verified with reference measurements and finite element simulations combined with a sound-field measurement.

Published in:

Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on

Date of Conference:

7-11 May 2008