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A new package structure based on printed circuit board (PCB) as carrier substrate was proposed, aiming at providing an implementation of system-in package (SiP) emphasizing small size and more importantly low cost. This structure is built upon a multilayer PCB, where open cavities are created in the top and bottom layers to house active dies, allowing package size reduction as well as protection against handling and impact. An application prototype was devised to integrate an RF IC and a baseband digital IC, typical of a wireless communication Rx system. Thermo-mechanical simulation models of the prototype are constructed to comparably assess certain aspects of its reliability and manufacturability. The results show comparable thermal performance compared with currently mainstream substrate material. Thermal cycling test of the new structure to experimentally evaluate its reliability is planned with results to be reported in a separate report.