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Advanced Topics and Future Trends in MCM Technology

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1 Author(s)

This chapter contains sections titled:
Introduction
Packaging Perspective
Integrated Circuit Technology
Integrated Circuit Technology Generations
National Technology Roadmap for Semiconductors
NTRS Assembly and Packaging
Interconnect Technology Issues
Emergence of MCM Technology
Three-Dimensional (3-D) MCMs
System-On-Chip
Superconductor Interconnects
Optical Interconnects
Diamond Substrates
Summary This chapter contains sections titled:
References

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