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Signal and Power Integrity Analysis of Differential Lines in Multilayer Printed Circuit Boards With Embedded Electromagnetic Bandgap Structures

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3 Author(s)
Scogna, A.C. ; Comput. Simulation Technol. (CST) of America, Framingham, MA, USA ; Orlandi, A. ; Ricchiuti, V.

In this paper, the analysis of the signal integrity and the power integrity (PI) performance of different types of electromagnetic bandgap structures (EBGs) in presence of differential (DIFF) striplines is proposed. Four different configurations of 2-D embedded EBG layers are analyzed. A test vehicle consisting in a 12-layer printed circuit board in standard FR4 material is built, and the measured results (validated by means of 3-D electromagnetic simulations) are used to estimate the signal quality in terms of the transmission parameter S21, time-domain reflectometry, and eye pattern at the terminations. The PI is, instead, analyzed by means of the noise coefficient from the source to different positions along the planes (S21). Results confirm the reliability of 2-D EBGs for noise mitigation and the enhancement in the signal quality when DIFF signals are used.

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Electromagnetic Compatibility, IEEE Transactions on  (Volume:52 ,  Issue: 2 )