Close category search window
 

Optimal sensor planning with minimal cost for 3D object recognition using sparse structured light images

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Xueyin Lin ; Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China ; Jianchao Zeng ; Qixiang Yao

A novel 3D CAD-based vision system by using sparse structured light images is presented in this paper. By using an eye-on-hand structured light sensor, sparse range images are collected from several different positions based upon the requirements in the process of object recognition and localization. In order to recognize object with minimal sensing activities, a novel concept of maximum expected rate of hypothesis reduction (MERHR) for sensor planning is proposed its implementational procedure is carefully designed. By pre-computing the sensor's optimal configuration and storing it into a lookup table, the heavy computation burden for sensor planning during on-line recognition phase can be avoided

Published in:
Robotics and Automation, 1996. Proceedings., 1996 IEEE International Conference on  (Volume:4 )

Date of Conference: 22-28 Apr 1996

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.