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Compliant bump technology for back-side illuminated CMOS image sensor

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16 Author(s)

We have developed a compliant bump technology for 3D chip stacking with the same number of inter-chip connections as that in a VGA (video graphic array, 640 times 480). Using this technology together with a through-Si via (TSV) technology, we demonstrate a prototype of back-side illuminated CMOS image sensor, in which a very-thin rear-illuminated photodiode array is electrically connected to the CMOS readout circuit at a pixel level.

Published in:

Electronic Components and Technology Conference, 2009. ECTC 2009. 59th

Date of Conference:

26-29 May 2009