By Topic

Identification of artifacts in Auger electron spectroscopy due to surface topography

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Gelsthorpe, A. ; University of York, Heslington, York, Yo10 5DD, United Kingdom ; El-Gomati, M.M.

Your organization might have access to this article on the publisher's site. To check, click on this link: 

The application of Auger electron spectroscopy to sharp topographies, such as microfabricated field emitters, leads to two analysis artifacts; edge enhancement and shadowing. As a result, the detected Auger electron peak heights can change by more than 100%; potentially giving rise to the wrong conclusions being drawn about the elemental surface concentrations. A single-pass cylindrical mirror analyzer has been modified for use in the rapid identification of such artifacts. The modifications comprises a multichannel electron detector divided into six segments spanning 360° of azimuth and an electrostatic lens that passes electrons to the electron detector along the same exit trajectory independently of their energy. Preliminary results of the use of the instrument in the analysis of a tungsten coated volcano-shaped silicon field-emitter structure are reported. The analysis simultaneously shows two different edge artifacts in the six spectra due to edge enhancement and shadowing. The experiment demonstrated here shows a rapid method for identifying these artifacts and avoids the need to repeat the experiment using a different angle of incidence, as was conventionally the case. © 2003 American Vacuum Society.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:21 ,  Issue: 2 )