By Topic

Abrupt reduction in poly-Si etch rate in HBr/O2 plasma

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Kuroda, Shinji ; Radioisotope Research Center, Osaka University, 2-4 Yamadaoka, Suita, Osaka 565, Japan ; Iwakuro, Hiroaki

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1116/1.590096 

The effect of oxygen on polycrystalline-Si (poly-Si) and SiO2 etching in hydrogen bromide (HBr) reactive ion etching plasmas has been studied by measuring etch rates and using x-ray photoelectron spectroscopy (XPS) to study compositional changes in the surface layer. The etch rate of the poly-Si increases dramatically from 30 to 235 nm/min as the O2 concentration increases from 0% to 25%, whereas the SiO2 etch rate gradually decreases from 3 to 1 nm/min. Above 30% O2 in HBr, the poly-Si etch rate abruptly decreases by a factor of 16 compared with that at 25%. From XPS analysis, it is found that the abrupt decrease of the poly-Si etch rate at O2 concentrations of more than 30% is closely related with the composition and thickness of an SiBrxOy layer formed during the HBr/O2 plasma exposure. The SiBrxOy layer has a composition of nearly SiO2. Br ions cannot permeate the SiBrxOy layer formed in plasmas containing 30% O2 in HBr (or greater), and therefore, the poly-Si etch terminates. © 1998 American Vacuum Society.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:16 ,  Issue: 4 )