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Air-bridges, air-ramps, planarization, and encapsulation using pyrolytic photoresist in the fabrication of three-dimensional microstructures

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10 Author(s)
Porkolab, G.A. ; Department of Computer Science and Electrical Engineering, University of Maryland Baltimore County, Baltimore, Maryland 21250 ; Chen, Y.J. ; Tabatabaei, Seyed Ahmad ; Agarwala, Sambhu
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Pyrolyzation of photolithographically patterned photoresist on semiconductor substrates such as silicon, gallium arsenide, and indium phosphide, results in a convex-shaped, chemically inert, temporary form that functions as a mold upon which to lift-off evaporated thin films such as metals. The pyrolyzation process is simply a bake on a standard laboratory hot-plate that is ramped from room temperature to 300 °C air. The pyrolytic-photoresist form is subsequently removed in an oxygen plasma stripper leaving behind the three-dimensional lifted off thin films of free-standing, convex-shaped, full-arch air-bridges or half-arch air-bridges that we call air-ramps. Some applications are interconnects for high-speed devices; inter-level interconnects; out-of-plane coils for out-of-plane inductors; microdomes for eletromagnetic shielding; electrodes for field-emitter tips; and microelectromechanical structures. Pyrolyzing photoresist does not alter the good planarization capabilities of photoresist. Because pyrolytic photoresist is a version of the earliest form of synthetic thermoset resin called Bakelite, it can also be used as a reasonably good encapsulation material. © 1997 American Vacuum Society.

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Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:15 ,  Issue: 6 )