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A very high heat flux microchannel heat exchanger for cooling of semiconductor laser diode arrays

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2 Author(s)
S. K. Roy ; PhD Res. Group Inc., Coral Gables, FL, USA ; B. L. Avanic

A low-cost, high heat flux heat exchanger for cooling of high power (of the order of 1000 W/cm2) semiconductor laser diode arrays has been designed and tested. The device uses a simple copper microchannel design to obtain very high fluid-to-wall heat transfer coefficients. Experimental results show that its overall thermal resistivity is less than 0.03°C/W, which is 2-3 times better than current state-of-the-art heat sinks. A different version of the heat sink has also been tested and has demonstrated the capability of dissipating 200-300 W from a conventionally (solder) bonded resistor of area of about 0.5 mm2 while limiting its surface temperature rise 20-30°C. When operated at low pressures [0.48 MPa (70 psi)], this design also has a performance comparable to existing state-of-the art heat sinks so that it can be readily used as a replacement in current high power applications

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IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:19 ,  Issue: 2 )