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Guidelines for high-performance electronic package interconnections approach for strong coupling

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2 Author(s)
Yaochao Yang ; Silicon Graphics Comput. Syst., Mountain View, CA, USA ; Brews, J.R.

For packages with high-density interconnections, crosstalk noise can cause signal errors. For cases with strong coupling between lines, design guidelines for packaging complementary metal-oxide-semiconductor (CMOS)-based circuits are developed here that incorporate crosstalk requirements with the tradeoffs related to the ringing problem on the active line, and the risetime requirements at the receiver. Semiempirical relations are given that can be used easily to obtain electrical parameters with given crosstalk, overshoot, and risetime at the receiver. Simulation program with integrated circuit emphasis (SPICE) simulation has been used to verify the accuracy of these expressions for some special cases. It is shown that the semiempirical relations work well for cases with strong coupling. Based on the design relations, it is shown that when the cross-sectional dimensions of a package system are reduced in order to increase packing density, the relative driver and receiver area have to be increased in order to maintain prespecified performance requirements

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 2 )